ST 意法半导体推出_ 0.6MP 小尺寸/低功耗的近红外先进2D全局快门图像传感器 : VD55G1


VD55G1是2.16μm的背照式全局快门影像传感器:

分辨率800x700, 使用ST Ultra compac技术,

拥有小型的Die尺寸 2.7mm x 2.2mm (even smaller size than other VGA sensors ).

并提高了近红外灵敏度( QE in 940nm).



规格及功能简介




VD55G1特性描述







应用场景 

专为高性能电脑/机器视觉应用而设计,包括 AR/VR、个人和工业机器人、无人机、条码、生物识别和手势、嵌入式视觉或场景识别。

高性能近红外线感测是关键的典型用例。

也要求场景中的电脑视觉不需要快门伪影。




VD55G1 Ultra-low power “Always-on” mode






所有功能
  • Compact global shutter technology (40 nm/65 nm)
    • High performance 2.16 μm x 2.16 μm BSI deep CDTI pixel
  • Smallest global shutter 804x704 pixels with a 5.9 mm2 footprint
    • Die size of only 2.7 mm x 2.2 mm; smaller than VGA equivalents
    • Small pixel array size of 1.73 mm x 1.73 mm
    • Optical format 1/10" with 600x600 crop
  • 颠覆性串流模式,采用 ST in-pixel技术, enabling features with a single frame,实现超低延迟和功耗.
    • Differential mode: ultrafast change tracking, event-like image
    • Background removal, without host processing
    • Spatial HDR, enabling 90dB+, without frame ghosting or latency
  • 自主自动唤醒模式,具有always-on的场景变化侦测功能。 主机可全关,仅VD55G1有功耗. 
    • 1.0 mW at 1 Hz
    • 1.5 mW at 5 Hz
    • 2.7 mW at 10 Hz
  • 功耗极低 _Very low power consumption
    • 800x700 (full IQ, 5 msec exposure) 7 mW at 10 fps 35 mW at 48 fps
    • 640x480 (full IQ, 5 msec exposure) 6 mW at 10 fps 29 mW at 48 fps
    • Power consumption scaling with features/framerate and software standby
  • 高帧率: 170 fps at 800x700, 260 fps at VGA and 460 fps at 320x240
  • Disruptive I3C interface
    • 10x faster control interface, fully backward compatible with I²C
    • I3C image output in parallel of CSI-2 (10 fps at 320x240 or 5 fps at 400x400)
  • Advanced raw ISP
    • Dynamic defective pixel correction
    • Smart noise pixel control (3 dB to 9 dB noise reduction)
    • Embedded multi auto exposure. Independent auto exposure per context
    • Different exposure for each pixel on the same frame (up to 3 exposures per frame)
    • Piece wise linear gamma (PWL), one setup per context, 4 points x/y per setup
    • Crop, analog, and digital binning (x2 and x4) and subsampling (x2 and x4)
    • Mirror/flip readout
  • Flexible camera module system
    • Programmable sequences of 4-frame contexts, including illumination control
    • Up to 4-LED control outputs, synchronized on sensor integration periods with flexible timings and PWM (pulse-width modulation) control
    • Master/slave with external frame start
    • 1024 bits OTP available for the user/host
    • Integrated temperature sensor with ± 2°C accuracy [25°C; 85°C]
    • 1.2 Gb/s single lane transmitter MIPI CSI-2, with support down to 400 Mb/s
  • Operating junction temperature: -30°C to 85°C
  • High optical performance: QE peak >= 90% and MTF 940 nm at 55% Nyquist/2, dynamic range of 65 dB

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参考来源

false: https://www.st.com/en/imaging-and-photonics-solutions/vd55g1.html

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