ST 意法半导体推出具有 200 MHz 调变的低杂讯、低功耗 0.54 Mpix、3D iToF 感测器芯片

关键字 :ToF iToF 3D-iToF 200MHz VD55H1

VD55H1 iToF特点:

_ Ultra-compact 0.54 Mpix iToF sensor die

• 672 x 804 indirect Time-of-Flight (iToF) sensor die (0.54 Mpixel)

• 4.6 μm backside illuminated (BSI) fast photodiode pixel, 1/4’’ optical format

• 4.5 mm x 4.9 mm die manufactured on advanced 40 nm stacked wafer technology

_实现低功耗、高精度深度图

• Pixel with >85% demodulation contrast at 200 MHz modulation frequency

• Low noise charge domain pixel (kTC free) < 5e-

• 支援多频率(up to three frequencies)

• 感测器平均耗电量低至 80 mW

• Smart iToF modulation, no need for wiggling error calibration

• Multi-user interferences reduction

• Optimized for low EMI/EMC

_Easy integration for 3D camera

• Raw data output on MIPI CSI2 interface at 1.5 GHz (quad or dual lane)

• 10/12-bit configurable ADC resolution

• Sensor raw output up to 120 fps (depth-level frame rate)

• 感测器控制: Fast mode+ I2C slave interface (up to 1 MHz)

• Laser driver interface: LVDS and 3-wire SPI

• 可用于深度重建的软体ISP

应用

• 房间测绘和物件扫描可增强扩增实境使用者体验

• 精确的深度分割，实现专业的散景相机效果 (Precise depth segmentation for professional bokeh camera effects)

• 用于支付和手机解锁的安全人脸验证 (Secure face authentication for payment and phone unlocking)

• 手势识别 (Gesture recognition)

• 行动装置

• AR/VR (AR/VR headsets)

• 消费机器人 (Consumer robots)

3D-iToF sensor for PC applications